Common USB PD Decoy Chips: CH224K vs HUSB238 vs HUSB237 vs IP2721 vs XSP

Sat, 11 Apr 2026 13:10:58 +0800

When building a USB PD sink/power-request design, decoy chips are usually selected by voltage capability, protocol support, and cost.

Chip Comparison

Chip	Key Features	Best For
CH224K (WCH)	Popular and cost-effective, resistor-configurable, up to 20V output	High-power PD requests and general-purpose designs
HUSB238 (Hynetek)	Small size, high integration, compliant with USB PD3.0, supports PPS and PD3.1 28V	Compact devices that need higher voltage output
HUSB237 (Hynetek)	Minimal PD Sink design, supports PD3.1 (5V/9V/12V/15V/20V), up to 20V/5A (100W), supports SOP’ (eMarker emulation), BC1.2 and QC2.0	Cost-effective sink designs that need very simple external circuitry, especially 100W cable-related use cases
IP2721 (Injoinic)	Auto plug-in/out detection, compatible with PD2.0/3.0, stable behavior	Products needing automatic detection and stronger protocol handling
XSP series (for example XSP01/XSP05)	Cost-effective, broad support for PD + QC + FCP + SCP + AFC	Multi-protocol fast-charging products such as phone adapters and wireless charging modules

Selection Tips

For mature and budget-friendly designs: start with CH224K or XSP series.
For compact boards and higher voltage demand: consider HUSB238 first.
For minimal BOM and up to 100W (20V/5A): consider HUSB237 first.
For stronger protocol handling and auto detection: consider IP2721 first.

Isolated vs Non-Isolated Power Supplies: Pros, Cons and Selection

Wed, 27 Apr 2022 00:00:00 +0000

Power modules can be roughly divided into isolated and non-isolated designs. The key difference is whether the input and output share a direct electrical reference.

In an isolated power supply, the input and output are separated by a transformer, optocoupler or another isolation barrier. In a non-isolated supply, the input and output usually share ground and are electrically connected.

Isolated Power Supply

An isolated power supply separates the input side from the output side. This improves safety and reduces the chance that faults on one side directly affect the other side.

Common advantages:

safer when input voltage is high;
better protection between systems;
useful when input and output grounds cannot be connected;
can reduce ground loop problems;
often required in medical, industrial and communication equipment.

Common disadvantages:

higher cost;
larger size;
lower efficiency in some designs;
more complex circuit structure.

Non-Isolated Power Supply

A non-isolated power supply does not provide electrical isolation between input and output. Buck converters and many small DC-DC modules are typical examples.

Common advantages:

low cost;
compact size;
high efficiency;
simple circuit;
suitable for low-voltage systems with common ground.

Common disadvantages:

input faults can reach the output more easily;
not suitable where safety isolation is required;
may cause ground loop issues;
input and output ground relationship must be understood.

How To Choose

Use an isolated power supply when:

the input voltage is dangerous;
the output is touched by users;
two systems must remain electrically separated;
noise or ground loops are a concern;
the application has safety requirements.

Use a non-isolated power supply when:

input and output are both low voltage;
the system shares a common ground;
efficiency, size and cost matter more;
the load is inside the same device;
safety isolation is not required.

Practical Reminder

Do not judge only by module appearance. Check the module specification and wiring diagram. Some modules are sold as DC-DC converters but do not provide isolation.

If the output side may be touched by people or connected to another independent system, isolation should be considered first.

Summary

Isolated power supplies are safer and more suitable for separated systems, but they cost more and are more complex. Non-isolated power supplies are efficient and cheap, but they require a clear common-ground design. The right choice depends on voltage, safety, grounding and system structure.

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